Koch-Chemie Micro Cut Pad

Koch Chemie Micro Cut Pads feature high-quality foam for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 or Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cell structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful, non-woven material is suitable for polishing and ensures process safety. Compression Hardness: 10 Abrasiveness: 5