Koch-Chemie Polishing & Sealing Pad

Koch Chemie Polishing & Sealing Pads feature extra-fine foam for economically and evenly applying sealing products such as the Lack-Polish Grun P1.01. The short height of 23mm creates low torsion forces, excellent handling and the highest level of stability. The optimized reticulation (open cellular structure) and cell count contribute to excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours eaily. The colorful, non-woven material is suitable for polishing and ensures process safety. Compression Hardness: 4 Abrasiveness: 2